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Features
* * * * *
Supply Voltage up to 40V Operating Voltage VS = 5V to 27V Typically 10 A Supply Current During Sleep Mode Typically 57 A Supply Current in Silent Mode Linear Low-drop Voltage Regulator: - Normal, Fail-safe, and Silent Mode - ATA6623: VCC = 3.3V 2% - ATA6625: VCC = 5.0V 2% - Sleep Mode: VCC is Switched Off VCC Undervoltage Detection with Reset Open Drain Output NRES (4 ms Reset Time) Voltage Regulator is Short-circuit and Over-temperature Protected LIN Physical Layer According to LIN Specification Revision 2.0 and SAEJ2602-2 Wake-up Capability via LIN Bus (90 s Dominant) TXD Time-out Timer Bus Pin is Overtemperature and Short-circuit Protected versus GND and Battery Advanced EMC and ESD Performance ESD HBM 8 kV at Pins LIN and VS Following STM5.1 Interference and Damage Protection According to ISO/CD7637 Package: SO8
* * * * * * * * * *
LIN Bus Transceiver with Integrated Voltage Regulator ATA6623 ATA6625 Preliminary
1. Description
ATA6623/ATA6625 is a fully integrated LIN transceiver, designed according to the LIN specification 2.0, with a low-drop voltage regulator (3.3V/5V/50 mA). The combination of voltage regulator and bus transceiver makes it possible to develop simple, but powerful, slave nodes in LIN Bus systems. ATA6623/ATA6625 is designed to handle the low-speed data communication in vehicles (for example, in convenience electronics). Improved slope control at the LIN driver ensures secure data communication up to 20 kBaud with an RC oscillator for the protocol handling. The bus output is designed to withstand high voltage. Sleep mode (voltage regulator switched off) and Silent mode (communication off; VCC voltage on) guarantee minimized current consumption.
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Figure 1-1.
Block Diagram
ATA6623/25
VCC Normal and Fail-safe mode
1
VS
RXD
5
Receiver
+ -
4 RF-filter
LIN
VCC Wake-up bus timer Short circuit and overtemperature protection
TXD
6
TXD Time-out timer
Slew rate control
8 EN 2 Sleep mode Control VCC unit switched off Normal/Silent/ Fail-safe mode 3.3V/50 mA/2% 5V/50 mA/2% Undervoltage reset 7
VCC NRES
GND
3
2. Pin Configuration
Figure 2-1. Pinning SO8
VS EN GND LIN 1 2 3 4 8 7 6 5 VCC NRES TXD RXD
Table 2-1.
Pin 1 2 3 4 5 6 7 8
Pin Description
Symbol VS EN GND LIN RXD TXD NRES VCC Function Battery supply Enables Normal mode if the input is high Ground, heat sink LIN bus line input/output Receive data output Transmit data input Output undervoltage reset, low at reset Output voltage regulator 3.3V/5V/50 mA
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3. Functional Description
3.1 Physical Layer Compatibility
Since the LIN physical layer is independent from higher LIN layers (e.g., LIN protocol layer), all nodes with a LIN physical layer according to revision 2.0 can be mixed with LIN physical layer nodes, which are according to older versions (i.e., LIN 1.0, LIN 1.1, LIN 1.2, LIN 1.3) without any restrictions.
3.2
Supply Pin (VS)
LIN operating voltage is VS = 5V to 27V. An undervoltage detection is implemented to disable transmission if VS falls below 5V, in order to avoid false bus messages. After switching on VS, the IC starts with the Fail-safe mode and the voltage regulator is switched on (i.e., 3.3V/5V/50 mA). The supply current in Sleep mode is typically 10 A and 57 A in Silent mode.
3.3
Ground Pin (GND)
The IC is neutral on the LIN pin in the event of GND disconnection. It is able to handle a ground shift up to 11.5% of VS.
3.4
Voltage Regulator Output Pin (VCC)
The internal 3.3V/5V voltage regulator is capable of driving loads with up to 50 mA, supplying the microcontroller and other ICs on the PCB and is protected against overload by means of current limitation and overtemperature shut-down. Furthermore, the output voltage is monitored and will cause a reset signal at the NRES output pin if it drops below a defined threshold Vthun.
3.5
Undervoltage Reset Output (NRES)
If the VCC voltage falls below the undervoltage detection threshold of Vthun, NRES switches to low after tres_f (Figure 6-1 on page 11). Even if VCC = 0V the NRES stays low, because it is internally driven from the VS voltage. If VS voltage ramps down, NRES stays low until VS < 1.5V and then becomes highly resistant. The implemented undervoltage delay keeps NRES low for tReset = 4 ms after VCC reaches its nominal value.
3.6
Bus Pin (LIN)
A low-side driver with internal current limitation and thermal shutdown as well as an internal pull-up resistor according to LIN specification 2.0 is implemented. The voltage range is from -27V to +40V. This pin exhibits no reverse current from the LIN bus to VS, even in the event of a GND shift or VBatt disconnection. The LIN receiver thresholds are compatible with the LIN protocol specification. The fall time (from recessive to dominant) and the rise time (from dominant to recessive) are slope controlled.
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3.7
Input Pin (TXD)
In Normal mode the TXD pin is the microcontroller interface to control the state of the LIN output. TXD must be pulled to ground in order to drive the LIN bus low. If TXD is high or unconnected (internal pull-up resistor), the LIN output transistor is turned off and the bus is in the recessive state.
3.8
Dominant Time-out Function (TXD)
The TXD input has an internal pull-up resistor. An internal timer prevents the bus line from being driven permanently in the dominant state. If TXD is forced to low longer than tDOM > 6 ms, the LIN bus driver is switched to the recessive state. Nevertheless, when switching to Sleep mode, the actual level at the TXD pin is relevant. To reactivate the LIN bus driver, switch TXD to high (> 10 s).
3.9
Output Pin (RXD)
The pin reports the state of the LIN-bus to the microcontroller. LIN high (recessive state) is reported by a high level at RXD; LIN low (dominant state) is reported by a low level at RXD. The output has an internal pull-up structure with typically 5 k to VCC. The AC characteristics are measured with an external load capacitor of 20 pF. The output is short-circuit protected. In Unpowered mode (that is, VS = 0V), RXD is switched off.
3.10
Enable Input Pin (EN)
This pin controls the Operation mode of the interface. After power up of VS (battery), the IC switches to Fail-safe mode, even if EN is low or unconnected (internal pull-down resistor). If EN is high, the interface is in Normal mode. A falling edge at EN while TXD is still high forces the device to Silent mode. A falling edge at EN while TXD is low forces the device to Sleep mode.
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4. Mode of Operation
Figure 4-1. Mode of Operation
Unpowered Mode VBatt = 0V b a a: VS > 5V b: VS < 4V c: Bus wake-up event d: NRES switches to low
Pre-normal Mode b d EN = 1
Go to silent command
VCC: 3.3V/5V/50 mA with undervoltage monitoring Communication: OFF EN = 1 c
b c+d
b Silent Mode
EN = 0 TXD = 1 Normal Mode VCC: 3.3V/5V/50 mA with undervoltage monitoring EN = 0 Communication: ON TXD = 0 Sleep Mode
Local wake-up event
EN = 1
VCC: 3.3V/5V/50 mA with undervoltage monitoring Communication: OFF
Go to sleep command
VCC: switched off Communication: OFF
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Table 4-1.
Mode of Operation Fail safe Normal Silent Sleep
Mode of Operation
Transceiver OFF ON OFF OFF VCC 3.3V/5V 3.3V/5V 3.3V/5V 0V RXD High High High 0V LIN Recessive TXD depending Recessive Recessive
4.1
Normal Mode
This is the normal transmitting and Receiving mode of the LIN Interface, in accordance with LIN specification 2.0. The VCC voltage regulator operates with a 3.3V/5V output voltage, with a low tolerance of 2% and a maximum output current of 50 mA. If an undervoltage condition occurs, NRES is switched to low and the IC changes its state to Fail-safe mode. All features are available.
4.2
Silent Mode
A falling edge at EN while TXD is high switches the IC into Silent mode. The TXD Signal has to be logic high during the Mode Select window (Figure 4-2 on page 7). The transmission path is disabled in Silent mode. The overall supply current from V Batt is a combination of the IVSsi = 57 A plus the VCC regulator output current IVCCs. The 3.3V/5V regulator with 2% tolerance can source up to 50 mA. In Silent mode the internal slave termination between pin LIN and pin VS is disabled to minimize the power dissipation in case pin LIN is short-circuited to GND. Only a weak pull-up current (typically 10 A) between pin LIN and pin VS is present. The Silent mode can be activated independently from the current level on pin LIN. If an undervoltage condition occurs, NRES is switched to low and the ATA6623/ATA6625 changes its state to Fail-safe mode. A voltage less than the LIN Pre-wake detection V LINL at pin LIN activates the internal LIN receiver. A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time period (tbus) and the following rising edge at pin LIN (see Figure 4-3 on page 7) results in a remote wake-up request. The device switches from Silent mode to Fail-safe mode, then the internal LIN slave termination resistor is switched on. The remote wake-up request is indicated by a low level at pin RXD to interrupt the microcontroller (Figure 4-3 on page 7). EN high can be used to switch directly to Normal mode.
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Figure 4-2. Switch to Silent Mode
Normal Mode Silent Mode
EN
TXD
Mode select window td = 3.2 s
NRES
VCC
Delay time silent mode td_sleep = maximum 20 s LIN LIN switches directly to recessive mode
Figure 4-3.
LIN Wake-up Waveform Diagram from Silent Mode
Bus wake-up filtering time tbus Fail-safe mode Normal mode
LIN bus
RXD
High
Low
VCC
Silent mode 3.3V/5V/50 mA
Fail-safe mode 3.3V/5V/50 mA
Normal mode
EN High EN
NRES
Undervoltage detection active
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4.3
Sleep Mode
A falling edge at EN while TXD is low switches the IC into Sleep mode. The TXD Signal has to be logic low during the Mode Select window (Figure 4-4 on page 8). In Sleep mode the transmission path is disabled. Supply current from V Batt is typically IVSsleep = 10 A. The VCC regulator is switched off; NRES and RXD are low. The internal slave termination between pin LIN and pin VS is disabled to minimize the power dissipation in case pin LIN is short-circuited to GND. Only a weak pull-up current (typically 10 A) between pin LIN and pin VS is present. The Sleep mode can be activated independently from the current level on pin LIN. A voltage less than the LIN Pre-wake detection V LINL at pin LIN activates the internal LIN receiver. A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time period (tbus) and a following rising edge at pin LIN respectively results in a remote wake-up request. The device switches from Sleep mode to Fail-safe mode. The VCC regulator is activated, and the internal LIN slave termination resistor is switched on. The remote wake-up request is indicated by a low level at the RXD pin to interrupt the microcontroller (Figure 4-5 on page 9). EN high can be used to switch directly from Sleep/Silent to Fail-safe mode. If EN is still high after VCC ramp up and undervoltage reset time, the IC switches to Normal mode. Figure 4-4. Switch to Sleep Mode
Normal Mode EN Sleep Mode
Mode select window TXD td = 3.2 s NRES
VCC
Delay time sleep mode td_sleep = maximum 20 s LIN LIN switches directly to recessive mode
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Figure 4-5. LIN Wake-up Diagram from Sleep Mode
Bus wake-up filtering time tbus Fail-safe Mode Normal Mode
LIN bus
RXD
Low or floating
Low
VCC voltage regulator
On state Off state Regulator wake-up time EN High
EN Reset time NRES Low or floating Microcontroller start-up time delay
4.4
Fail-safe Mode
At system power-up the device automatically switches to Fail-safe mode. The voltage regulator is switched on (VCC = 3.3V/5V/50 mA), (see Figure 6-1 on page 11). The NRES output switches to low for tres = 4 ms and gives a reset to the microcontroller. LIN communication is switched off. The IC stays in this mode until EN is switched to high, and changes then to the Normal mode. A power down of VBatt (VS < 4V) during Silent- or Sleep mode switches the IC into the Fail-safe mode after power up. A logic low at NRES switches the IC into Fail-safe mode directly.
4.5
Unpowered Mode
If you connect battery voltage to the application circuit, the voltage at the VS pin increases according to the block capacitor (see Figure 6-1 on page 11). After VS is higher than the VS undervoltage threshold VSth, the IC mode changes from Unpowered mode to Fail-safe mode. The VCC output voltage reaches its nominal value after tVCC. This time, tVCC, depends on the VCC capacitor and the load. NRES is low for the reset time delay tReset; no mode change is possible during this time.
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5. Fail-safe Features
* During a short-circuit at LIN to VBattery, the output limits the output current to IBUS_LIM. Due to the power dissipation, the chip temperature exceeds TLINoff and the LIN output is switched off. The chip cools down and after a hysteresis of Thys, switches the output on again. RXD stays on high because LIN is high. During LIN overtemperature switch-off, the VCC regulator is working independently. * During a short-circuit from LIN to GND the IC can be switched into Sleep or Silent mode. If the short-circuit disappears, the IC starts with a remote wake-up. * The reverse current is very low < 15 A at pin LIN during loss of VBatt or GND. This is optimal behavior for bus systems where some slave nodes are supplied from battery or ignition. * During a short circuit at VCC, the output limits the output current to IVCCn. Because of undervoltage, NRES switches to low and sends a reset to the microcontroller. The IC switches into Fail-safe mode. If the chip temperature exceeds the value TVCCoff, the VCC output switches off. The chip cools down and after a hysteresis of Thys, switches the output on again. Because of Fail-safe mode, the VCC voltage will switch on again although EN is switched off from the microcontroller.The microcontroller can then start with normal operation. * Pin EN provides a pull-down resistor to force the transceiver into recessive mode if EN is disconnected. * Pin RXD is set floating if VBatt is disconnected. * Pin TXD provides a pull-up resistor to force the transceiver into recessive mode if TXD is disconnected. * If TXD is short-circuited to GND, it is possible to switch to Sleep mode via ENABLE after tdom > 20 ms.
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6. Voltage Regulator
Figure 6-1. VCC Voltage Regulator: Ramp Up and Undervoltage
VS 12V
5.5V/3.8V
VCC 5V/3.3V Vthun
tVCC NRES 5V/3.3V
tReset
tres_f
The voltage regulator needs an external capacitor for compensation and to smooth the disturbances from the microcontroller. It is recommended to use an electrolythic capacitor with C > 10 F and a ceramic capacitor with C = 100 nF. The values of these capacitors can be varied by the customer, depending on the application. With this special SO8 package (fused lead frame to pin3) an Rthja of 80 K/W is achieved. Therefore, it is recommended to connect pin 3 with a wide GND plate on the printed board to get a good heat sink. The main power dissipation of the IC is created from the V CC output current IVCC , which is needed for the application. Figure 6-2 shows the safe operating area of the ATA6623/ATA6625.
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Figure 6-2.
Power Dissipation: Save Operating Area versus VCC Output Current and Supply Voltage VS at Different Ambient Temperatures Due to Rthja = 80 K/W
60.00 50.00 40.00 Iout_85: Tamb = 85C Iout_85: Tamb = 95C Iout_105: Tamb = 105C 30.00 20.00 10.00 0.00 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
For programming purposes of the microcontroller it is potentially neccessary to supply the VCC output via an external power supply while the VS Pin of the system basis chip is disconnected. This behavior is no problem for the system basis chip.
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IVCC (mA)
ATA6623/ATA6625 [Preliminary]
7. Absolute Maximum Ratings
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameters Supply voltage VS Pulse time 500 ms Ta = 25C Output current IVCC 50 mA Pulse time 2 min Ta = 25C Output current IVCC 50 mA Logic pins (RxD, TxD, EN, NRES) Output current NRES LIN - DC voltage VCC - DC voltage According to IBEE LIN EMC Test specification 1.0 following IEC 61000-4-2 - Pin VS, LIN to GND ESD HBM following STM5.1 with 1.5 k/100 pF - Pin VS, LIN to GND HBM ESD ANSI/ESD-STM5.1 JESD22-A114 AEC-Q100 (002) CDM ESD STM 5.3.1 Junction temperature Storage temperature Operating ambient temperature Thermal resistance junction to ambient (free air) Special heat sink at GND (pin 3) on PCB Thermal shutdown of VCC regulator Thermal shutdown of LIN output Thermal shutdown hysteresis Tj Ts Ta Rthja Rthja TVCCoff TLINoff Thys 150 150 80 160 160 10 170 170 INRES -27 -0.3 Symbol VS VS Min. -0.3 Typ. Max. +40 +40 Unit V V
VS -0.3
27 +5.5 +2 +40 +5.5
V V mA V V
6
KV
8 3
KV KV
750 -40 -55 -40 +150 +150 +125 145
V C C C K/W K/W C C C
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8. Electrical Characteristics
5V < VS < 27V, -40C < Tj < 150C; unless otherwise specified all values refer to GND pins. No. 1 1.1 Parameters VS Pin Nominal DC voltage range Sleep mode VLIN > VS - 0.5V VS < 14V (Tj = 25C) Sleep mode VLIN > VS - 0.5V VS < 14V (Tj = 125C) Bus recessive VS < 14V (Tj = 25C) Without load at VCC Bus recessive VS < 14V (Tj = 125C) Without load at VCC VS VS VS IVSsleep 5 13.5 27 V A Test Conditions Pin Symbol Min. Typ. Max. Unit Type*
VS
3
10
14
A
A
1.2
Supply current in Sleep mode
IVSsleep
5
11
16
A
A
IVSsi
47
57
67
A
A
1.3
Supply current in Silent mode
IVSsi
56
66
76
A
A
1.4
Bus recessive Supply current in Normal VS < 14V mode Without load at VCC Bus dominant Supply current in Normal VS < 14V mode VCC load current 50 mA VS undervoltage threshold VS undervoltage threshold hysteresis RXD Output Pin Low level input current Normal mode VLIN = 0V VRXD = 0.4V
IVSrec
0.3
0.8
mA
A
1.5
VS
IVSdom VSth VSth_hys
50
53
mA
A
1.6 1.7 2 2.1 2.2 2.3 3 3.1 3.2 3.3 3.4 4 4.1 4.2 4.3 4.4
VS VS
4.0
4.5 0.2
5
V V
A A
RXD RXD RXD TXD TXD
IRXD VRXDL RRXD VTXDL VTXDH RTXD ITXD
1.3
2.5
8 0.4
mA V k V V k A
A A A A A A A
Low level output voltage IRXD = 1 mA Internal resistor to VCC TXD Input Pin Low level voltage input High level voltage input Pull-up resistor High level leakage current EN Input Pin Low level voltage input High level voltage input Pull-down resistor Low level input current VEN = 5V VEN = 0V VTXD = 0V VTXD = 5V
3 -0.3 2 125 -3
5
7 +0.8 VCC + 0.3V
TXD TXD
250
400 +3
EN EN EN EN
VENL VENH REN IEN
-0.3 2 50 -3 125
+0.8 VCC + 0.3V 200 +3
V V k A
A A A A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
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8. Electrical Characteristics (Continued)
5V < VS < 27V, -40C < Tj < 150C; unless otherwise specified all values refer to GND pins. No. 5 5.1 Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* NRES Open Drain Output Pin VS 5.5V Low level output voltage INRES = 1 mA INRES = 250 A Low level output low Undervoltage reset time 10 k to VCC VCC = 0V VVS 5.5V CNRES = 20 pF NRES VNRESL VNRESL VNRESLL tReset tres_f 2 1.5 4 0.2 0.14 0.2 6 10 V V V ms s A A A A A
5.2 5.3 5.4 6 6.1 6.2 6.3 6.4 6.5 6.6
NRES NRES NRES
Reset debounce time for VVS 5.5V falling edge CNRES = 20 pF VCC Voltage Regulator ATA6623 Output voltage VCC Output voltage VCC at low VS Regulator drop voltage Regulator drop voltage Line regulation maximum Load regulation maximum Power supply ripple rejection 4V < VS < 18V (0 mA to 50 mA) 3V < VS < 4V VS > 3V, IVCC = -15 mA VS > 3V, IVCC = -50 mA 4V < VS < 18V 5 mA < IVCC < 50 mA 10 Hz to 100 kHz CVCC = 10 F VS = 14V, IVCC = -15 mA
VCC VCC VCC VCC VCC VCC
VCCnor VCClow VDrop1 VDrop2 VCCline VCCload
3.234 VVS - VDrop 500
3.366 3.366 200 700 1 0.5 2
V V mV mV % %
A A A A A A
6.7 6.8 6.9 6.10 6.11 6.12 7 7.1 7.2 7.3 7.4 7.5 7.6
50 VCC VCC VCC VCC VCC IVCCs Cload VthunN Vhysthun tVCC -200 1.8 2.8 150 100 250 -160 10 3.2
dB mA F V mV s
C A D A A A
Output current limitation VS > 4V Load capacity VCC undervoltage threshold Hysteresis of undervoltage threshold Ramp up time VS > 4V to VCC = 3.3V 1 < ESR < 5 @ 100 kHz Referred to VCC VS > 4V Referred to VCC VS > 4V CVCC = 2.2 F Iload = -5 mA at VCC 5.5V < VS < 18V (0 mA to 50 mA) 4V < VS < 5.5V VS > 4V, IVCC = -20 mA VS > 4V, IVCC = -50 mA VS > 3.3V, IVCC = -15 mA 5.5V < VS < 18V
VCC Voltage Regulator ATA6625 Output voltage VCC Output voltage VCC at low VS Regulator drop voltage Regulator drop voltage Regulator drop voltage Line regulation maximum VCC VCC VCC VCC VCC VCC VCCnor VCClow VD1 VD2 VD3 VCCline 400 4.9 VVS - VD 5.1 5.1 250 600 200 1 V V mV mV mV % A A A A A A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
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8. Electrical Characteristics (Continued)
5V < VS < 27V, -40C < Tj < 150C; unless otherwise specified all values refer to GND pins. No. 7.7 7.8 7.9 7.10 7.11 7.12 Parameters Load regulation maximum Load capacity VCC undervoltage threshold Hysteresis of undervoltage threshold Test Conditions 5 mA < IVCC < 50 mA Pin VCC VCC VCC VCC VCC VCC Symbol VCCload IVCCs Cload VthunN Vhysthun TVCC -200 1.8 4.2 250 130 300 Min. Typ. 0.5 -160 10 4.8 Max. 2 Unit % mA F V mV s Type* A A D A A A
Output current limitation VS > 5.5V 1 < ESR < 5 @ 100 kHz Referred to VCC VS > 5.5V Referred to VCC VS > 5.5V
Ramp up time VS > 5.5V CVCC = 2.2 F Iload = -5 mA at VCC to VCC = 5V
8
LIN Bus Driver: Bus Load Conditions: Load 1 (Small): 1 nF, 1 k; Load 2 (Large): 10 nF, 500; RRXD = 5 k; CRXD = 20 pF 10.5, 10.6 and 10.7 Specifies the Timing Parameters for Proper Operation at 20 Kbps Driver recessive output voltage Driver dominant voltage Driver dominant voltage Driver dominant voltage Driver dominant voltage Pull-up resistor to VS LIN current limitation VBUS = VBatt_max Input leakage current at the receiver including pull-up resistor as specified Leakage current LIN recessive Input Leakage current Driver off VBUS = 0V VBatt = 12V Driver off 8V < VBatt < 18V 8V < VBUS < 18V VBUS VBatt Load1/Load2 VVS = 7V Rload = 500 VVS = 18V Rload = 500 VVS = 7V Rload = 1000 VVS = 18V Rload = 1000 The serial diode is mandatory LIN LIN LIN LIN LIN LIN LIN VBUSrec V_LoSUP V_HiSUP V_LoSUP_1k V_HiSUP_1k RLIN IBUS_LIM 0.6 0.8 20 40 30 120 60 200 0.9 x VS VS 1.2 2 V V V V V k mA A A A A A A A
8.1 8.2 8.3 8.4 8.5 8.6 8.7
8.8
LIN
IBUS_PAS_dom
-1
-0.35
mA
A
8.9
LIN
IBUS_PAS_rec
15
20
A
A
8.10
Leakage current when control unit disconnected from ground. GNDDevice = VS VBatt = 12V Loss of local ground 0V < VBUS < 18V must not affect communication in the residual network Node has to sustain the VBatt disconnected current that can flow under this condition. Bus VSUP_Device = GND must remain operational 0V < VBUS < 18V under this condition.
LIN
IBUS_NO_gnd
-10
+0.5
+10
A
A
8.11
LIN
IBUS
5
15
A
A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
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8. Electrical Characteristics (Continued)
5V < VS < 27V, -40C < Tj < 150C; unless otherwise specified all values refer to GND pins. No. 9 9.1 9.2 9.3 9.4 9.5 9.6 10 10.1 Parameters LIN Bus Receiver Center of receiver threshold VBUS_CNT = (Vth_dom + Vth_rec)/2 LIN LIN LIN LIN LIN Activates the LIN receiver LIN VBUS_CNT VBUSdom VBUSrec VBUShys VLINH VLINL 0.475 x VS -27 0.6 x VS 0.028 x VS VS - 1V -27 0.1 x VS 0.5 x VS 0.525 x VS 0.4 x VS 40 0.175 x VS VS + 0.3V VS - 3.3V V V V V V V A A A A A A Test Conditions Pin Symbol Min. Typ. Max. Unit Type*
Receiver dominant state VEN = 5V Receiver recessive state VEN = 5V Receiver input hysteresis Pre-wake detection LIN High level input voltage Pre-wake detection LIN Low level input voltage Internal Timers Dominant time for wake-up via LIN bus VLIN = 0V Vhys = Vth_rec - Vth_dom
tbus
30
90
150
s
A
10.2
Time delay for mode change from Pre-normal V = 5V into Normal mode via pin EN EN Time delay for mode change from Normal V = 0V mode to Sleep mode via EN pin EN TXD dominant time out timer VTXD = 0V THRec(max) = 0.744 x VS THDom(max) = 0.581 x VS VS = 7.0V to 18V tBit = 50 ms D1 = tbus_rec(min)/(2 x tBit) THRec(min) = 0.422 x VS THDom(min) = 0.284 x VS VS = 7.6V to 18V tBit = 50 ms D2 = tbus_rec(max)/(2 x tBit) THRec(max) = 0.778 x VS THDom(max) = 0.616 x VS VS = 7.0V to 18V tBit = 96 ms D3 = tbus_rec(min)/(2 x tBit) THRec(min) = 0.389 x VS THDom(min) = 0.251 x VS VS = 7.6V to 18V tBit = 96 ms D4 = tbus_rec(max)/(2 x tBit) VS = 7.0V to 18V
tnorm
5
20
s
A
10.3
tsleep
2
7
15
s
A
10.4
tdom
6
13
20
ms
A
10.5
Duty cycle 1
D1
0.396
A
10.6
Duty cycle 2
D2
0.581
A
10.7
Duty cycle 3
D3
0.417
A
10.8
Duty cycle 4
D4
0.590
A
10.9
Slope time falling and rising edge at LIN
tSLOPE_fall tSLOPE_rise
3.5
22.5
s
A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
17
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8. Electrical Characteristics (Continued)
5V < VS < 27V, -40C < Tj < 150C; unless otherwise specified all values refer to GND pins. No. 11 11.1 Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* Receiver Electrical AC Parameters of the LIN Physical Layer LIN Receiver, RXD Load Conditions (CRXD): 20 pF; Rpull-up = 2.4 k Propagation delay of receiver Figure 8-1 VS = 7.0V to 18V trx_pd = max(trx_pdr, trx_pdf) trx_pd trx_sym -2 6 s A
11.2
Symmetry of receiver VS = 7.0V to 18V propagation delay rising trx_sym = trx_pdr - trx_pdf edge minus falling edge
+2
s
A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Figure 8-1.
Definition of Bus Timing Characteristics
tBit tBit tBit
TXD (Input to transmitting node)
tBus_dom(max)
tBus_rec(min)
THRec(max) VS (Transceiver supply of transmitting node) THDom(max) LIN Bus Signal THRec(min) THDom(min)
Thresholds of receiving node1
Thresholds of receiving node2
tBus_dom(min)
tBus_rec(max)
RXD (Output of receiving node1) trx_pdf(1) trx_pdr(1)
RXD (Output of receiving node2) trx_pdr(2) trx_pdf(2)
18
ATA6623/ATA6625 [Preliminary]
4957D-AUTO-07/07
ATA6623/ATA6625 [Preliminary]
Figure 8-2. Application Circuit
VCC
VCC
ATA6623/25
1
VS +
VBAT
RXD 5
Receiver
+ -
Normal and fail-safe mode 4 RF filter LIN
100 nF
22 F
LIN-BUS
220 pF
VCC
Microcontroller
TXD 6 TXD Time-out timer
Wake-up bus timer
Short circuit and overtemperature protection
Slew rate control
8 EN 2 Control unit GND 3 Sleep mode VCC switched off Normal Mode and silent mode 3.3V/50 mA/2% 5V/50 mA/2% Undervoltage reset
VCC
7
NRES
10 k
100 nF
10 F
19
4957D-AUTO-07/07
9. Ordering Information
Extended Type Number ATA6623-TAQY ATA6625-TAQY ATA6623-TAPY ATA6625-TAPY Package SO8 SO8 SO8 SO8 Remarks 3.3V LIN system basis chip, Pb-free, 4k, taped and reeled 5V LIN system basis chip, Pb-free, 4k, taped and reeled 3.3V LIN system basis chip, Pb-free, 1k, taped and reeled 5V LIN system basis chip, Pb-free, 1k, taped and reeled
10. Package Information
Package SO8
Dimensions in mm
5.00 4.85 1.4 0.4 1.27 3.81 8 5 0.25 0.10 0.2 3.8 6.15 5.85 5.2 4.8 3.7
technical drawings according to DIN specifications
1
4
20
ATA6623/ATA6625 [Preliminary]
4957D-AUTO-07/07
ATA6623/ATA6625 [Preliminary]
11. Revision History
Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. History * Features changed * Block diagram changed * Application diagram changed * Text changed under the headings: 3.2, 3.3, 3.4, 3.6, 3.7, 3.8, 3.9, 4, 4.1, 4.2, 4.3, 4.4, 4.5, 5.5, 5.6, 6 * Figure 4-2, 4-3, 4-4, 4-5, 8-2: changed * Figure title 6-1: text changed * Abs. Max. Ratings: row "Output current NRES" added * El. Char. table: values changed in the following rows: 1.3, 5.1, 5.3, 5.4, 6.9, 6.12, 7.9, 11.1 * Features on page 1 changed * Table 2-1 "Pin Description" on page 2 changed * Section 3-1 "Physical Layer Compatibility" on page 3 added * Section 3-2 "Supply Pin (VS) on page 3 changed * Section 3-3 "Ground Pin (GND) on page 3 changed * Section 3-8 "Dominant Time-out Function (TXD)" on page 4 changed * Section 4-1 "Normal Mode" on page 5 changed * Section 4-2 "Silent Mode" on page 5 changed * Figure 4-3 "LIN Wake-up Waveform Diagram from Silent Mode" on page 6 changed * Section 4.3 "Sleep Mode" on page 7 changed * Section 4-5 "Unpowered Mode" on page 7 changed * Figure 4-4 "Switch to Sleep Mode" on page 8 changed * Figure 4-6 "VCC Voltage Regulator: Ramp up and Undervoltage" on page 9 changed * Section 5 "Fail-safe Features on page 9 changed * Section 6 "Voltage Regulator" on page 10 changed * Section 7 "Absolute Maximum Ratings" on page 11 changed * Section 8 "Electrical Characteristics" on pages 12 to 16 changed * Section 9 "Ordering Information" on page 18 changed
4957D-AUTO-07/07
4957C-AUTO-02/07
21
4957D-AUTO-07/07
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4957D-AUTO-07/07

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